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Brief introduction
Welding Diode module,MDC55,55A,Air Cooling,produced by TECHSEM .
VRRM | Type & Outline |
600V 800V 1000V 1200V 1400V 1600V 1800V | MDC55-06-229H3 MDC55-08-229H3 MDC55-10-229H3 MDC55-12-229H3 MDC55-14-229H3 MDC55-16-229H3 MDC55-18-229H3 |
Features:
Typical Applications:
SYMBOL |
CHARACTERISTIC |
TEST CONDITIONS | Tj(℃) | VALUE |
UNIT | ||
Min | Type | Max | |||||
IF(AV) | Mean forward current | 180°half sine wave 50Hz Single side cooled, TC=100℃ | 150 |
|
| 55 | A |
IF(RMS) | RMS forward current | 150 |
|
| 86 | A | |
IRRM | Repetitive peak current | at VRRM | 150 |
|
| 8 | mA |
IFSM | Surge forward current | 10ms half sine wave VR=0.6VRRM |
150 |
|
| 1.8 | kA |
I2t | I2t for fusing coordination |
|
| 16.2 | 103A2s | ||
VFO | Threshold voltage |
|
150 |
|
| 0.80 | V |
rF | Forward slope resistance |
|
| 3.74 | mΩ | ||
VFM | Peak forward voltage | IFM= 170A | 25 |
|
| 1.40 | V |
Rth(j-c) | Thermal resistance Junction to case | Single side cooled per chip |
|
|
| 0.70 | ℃ /W |
Rth(c-h) | Thermal resistance case to heatsink | Single side cooled per chip |
|
|
| 0.20 | ℃ /W |
Viso | Isolation voltage | 50Hz, R.M.S,t=1min, Iiso:1mA(max) |
| 3000 |
|
| V |
Fm | Terminal connection torque(M5) |
|
| 2.5 |
| 4.0 | N·m |
Mounting torque(M6) |
|
| 4.5 |
| 6.0 | N·m | |
Tvj | Junction temperature |
|
| -40 |
| 150 | ℃ |
Tstg | Stored temperature |
|
| -40 |
| 125 | ℃ |
Wt | Weight |
|
|
| 100 |
| g |
Outline | 224H3 |
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