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Brief introduction
Fast Recovery Diode Modules , MZx400,Air Cooling,produced by TECHSEM .
VRRM | Type & Outline |
600V 800V 1000V 1200V 1400V 1600V 1800V 1800V | MZx400-06-406F3 MZx400-08-406F3 MZx400-10-406F3 MZx400-12-406F3 MZx400-14-406F3 MZx400-16-406F3 MZx400-18-406F3 MZx400-18-406F3G |
Features:
Typical Applications:
SYMBOL |
CHARACTERISTIC |
TEST CONDITIONS | Tj(℃) | VALUE |
UNIT | ||
Min | Type | Max | |||||
IF(AV) | Mean forward current | 180°half sine wave 50Hz Single side cooled,TC=60℃ |
150 |
|
| 400 | A |
IF (RMS) | RMS forward current |
|
| 628 | A | ||
IRRM | Repetitive peak current | at VRRM | 150 |
|
| 70 | mA |
IFSM | Surge forward current | 10ms half sine wave VR=0.6VRRM |
150 |
|
| 8.30 | kA |
I2t | I2t for fusing coordination |
|
| 344 | A2s*103 | ||
VFO | Threshold voltage |
|
150 |
|
| 1.0 | V |
rF | Forward slope resistance |
|
| 0.85 | m | ||
VFM | Peak forward voltage | IFM= 1200A | 25 |
|
| 2.1 | V |
trr | Reverse recovery time | IFM=300A,tp=4000μs, -di/dt=20A/μs,VR=50V | 150 |
| 4.0 |
| μs |
25 |
| 2.0 |
| μs | |||
Rth(j-c) | Thermal resistance Junction to case | Single side cooled per chip |
|
|
| 0.130 | ℃ /W |
Rth(c-h) | Thermal resistance case to heatsink | Single side cooled per chip |
|
|
| 0.040 | ℃ /W |
Viso | Isolation voltage | 50Hz,R.M.S,t= 1min,Iiso:1mA(MAX) |
| 3000 |
|
| V |
Fm | Terminal connection torque(M10) |
|
| 10.0 |
| 12.0 | N·m |
Mounting torque(M6) |
|
| 4.5 |
| 6.0 | N·m | |
Tvj | Junction temperature |
|
| -40 |
| 150 | ℃ |
Tstg | Stored temperature |
|
| -40 |
| 125 | ℃ |
Wt | Weight |
|
|
| 1580 |
| g |
Outline | 406F3 |
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