MDC90,Welding Diode module,Air cooling

SYMBOL

CHARACTERISTIC

TEST CONDITIONS

Tj(。C)

VALUE

UNIT

Min

Type

Max

IF(AV)

Mean forward current

180。half sine wave 50Hz

Single side cooled, TC=100。C

150

90

A

IF(RMS)

RMS forward current

150

141

A

IRRM

Repetitive peak current

at VRRM

150

8

mA

IFSM

Surge forward current

10ms half sine wave VR=0.6VRRM

150

2.0

kA

I2t

I2t for fusing coordination

20.0

A2s*103

VFO

Threshold voltage

150

0.80

V

rF

Forward slope resistance

1.70

mΩ

VFM

Peak forward voltage

IFM=270A

25

1.50

V

Rth(j-c)

Thermal resistance Junction to case

Single side cooled per chip

0.47

。C /W

Rth(c-h)

Thermal resistance case to heatsink

Single side cooled per chip

0.20

。C /W

Viso

Isolation voltage

50Hz, R.M.S,t=1min, Iiso:1mA(max)

3000

V

Fm

Terminal connection torque(M5)

2.5

4.0

N·m

Mounting torque(M6)

4.5

6.0

N·m

Tvj

Junction temperature

-40

150

。C

Tstg

Stored temperature

-40

125

。C

Wt

Weight

100

g

Outline

224H3