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Brief introduction
Welding Diode module,MDC110,110A,Air Cooling,produced by TECHSEM .
VRRM | Type & Outline |
600V 800V 1000V 1200V 1400V 1600V 1800V | MDC110-06-229H3 MDC110-08-229H3 MDC110-10-229H3 MDC110-12-229H3 MDC110-14-229H3 MDC110-16-229H3 MDC110-18-229H3 |
Features:
Typical Applications:
SYMBOL |
CHARACTERISTIC |
TEST CONDITIONS | Tj(℃) | VALUE |
UNIT | ||
Min | Type | Max | |||||
IF(AV) | Mean forward current | 180°half sine wave 50Hz Single side cooled, TC=100℃ |
150 |
|
| 110 | A |
IF(RMS) | RMS forward current |
|
| 173 | A | ||
IRRM | Repetitive peak current | at VRRM | 150 |
|
| 8 | mA |
IFSM | Surge forward current | VR=60%VRRM,,t= 10ms half sine, |
150 |
|
| 2.0 | kA |
I2t | I2t for fusing coordination |
|
| 20.0 | 103A2s | ||
VFO | Threshold voltage |
|
150 |
|
| 0.80 | V |
rF | Forward slope resistance |
|
| 1.74 | mΩ | ||
VFM | Peak forward voltage | IFM=330A | 25 |
|
| 1.55 | V |
Rth(j-c) | Thermal resistance Junction to case | At 1800 sine. Single side cooled per chip |
|
|
| 0.35 | ℃/W |
Rth(c-h) | Thermal resistance case to heatsink | At 1800 sine. Single side cooled per chip |
|
|
| 0.20 | ℃/W |
Viso | Isolation voltage | 50Hz,R.M.S,t= 1min,Iiso:1mA(MAX) |
| 3000 |
|
| V |
Fm | Terminal connection torque(M5) |
|
| 2.5 |
| 4 | N·m |
Mounting torque(M6) |
|
| 4.5 |
| 6 | N·m | |
Tvj | Junction temperature |
|
| -40 |
| 150 | ℃ |
Tstg | Stored temperature |
|
| -40 |
| 125 | ℃ |
Wt | Weight |
|
|
| 100 |
| g |
Outline | 224H3 |
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