Diode Modules,MDx600-08-417F2,MDx600-10-417F2,MDx600-12-417F2,MDx600-14-417F2,MDx600-16-417F2,MDx600-18-417F2
Features
Typical Applications
VRSM | VRRM | Type & Outline |
900V | 800V | MDx600-08-417F2 |
1100V | 1000V | MDx600-10-417F2 |
1300V | 1200V | MDx600-12-417F2 |
1500V | 1400V | MDx600-14-417F2 |
1700V | 1600V | MDx600-16-417F2 |
1900V | 1800V | MDx600-18-417F2 |
SYMBOL |
CHARACTERISTIC |
TEST CONDITIONS |
Tj(℃) | VALUE |
UNIT | ||
Min | Type | Max | |||||
IF(AV) | Mean forward current | 180° half sine wave 50Hz Single side cooled, TC=100℃ | 150 |
|
| 600 | A |
IF (RMS) | RMS forward current | 150 |
|
| 942 | A | |
IRRM | Repetitive peak current | at VRRM | 150 |
|
| 30 | mA |
IFSM | Surge forward current |
10ms half sine wave VR=0.6VRRM |
150 |
|
| 19.0 | kA |
I2t | I2t for fusing coordination |
|
| 1805 | A2s*103 | ||
VFO | Threshold voltage |
|
150 |
|
| 0.75 | V |
rF | Forward slope resistance |
|
| 0.35 | mΩ | ||
VFM | Peak forward voltage | IFM=1500A | 25 |
|
| 1.35 | V |
Rth(j-c) | Thermal resistance Junction to case | At 180°sine, Single side cooled per chip |
|
|
| 0.065 | ℃/W |
Rth(c-h) | Thermal resistance case to heatsink | At 180° sine, Single side cooled per chip |
|
|
| 0.024 | ℃/W |
Viso | Isolation voltage | 50Hz,R.M.S,t=1min,Iiso:1mA(max) |
| 3000 |
|
| V |
Fm | Terminal connection torque(M10) |
|
|
| 12.0 |
| N·m |
Mounting torque(M6) |
|
|
| 6.0 |
| N·m | |
Tvj | Junction temperature |
|
| -40 |
| 150 | ℃ |
Tstg | Stored temperature |
|
| -40 |
| 125 | ℃ |
Wt | Weight |
|
|
| 775 |
| g |
Outline | 417F2 |
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