Brief introduction
Diode Modules(Non-isolated Type) ,MDx200,800V~1800V,produced by TECHSEM .
VRRM |
Type & Outline |
800V 1000V 1200V 1400V 1600V 1800V |
MDx200-08-213F4 MDx200-10-213F4 MDx200-12-213F4 MDx200-14-213F4 MDx200-16-213F4 MDx200-18-213F4 |
Features：
-
Non-isolated. Mounting base as common anode cathode terminal.
- Pressure contact technology withIncreased power cycling capability
- Low forward voltage drop
Typical Applications：
- Welding Power Supply
- Various Dc power supplies
|
SYMBOL
|
CHARACTERISTIC
|
TEST CONDITIONS
|
Tj(。C) |
VALUE |
UNIT
|
Min |
Type |
Max |
IF(AV) |
Mean forward current |
180°half sine wave 50Hz
Single side cooled, TC=100℃
|
150
|
|
|
200 |
A |
IF(RMS) |
RMS forward current |
|
|
314 |
A |
IRRM |
Repetitive peak current |
at VRRM |
150 |
|
|
20 |
mA |
IFSM |
Surge forward current |
VR=60%VRRM, t=10ms half sine |
150
|
|
|
6.2 |
kA |
I2t |
I2t for fusing coordination |
|
|
192 |
103A2s |
VFO |
Threshold voltage |
|
150
|
|
|
0.80 |
V |
rF |
Forward slope resistance |
|
|
0.96 |
mΩ |
VFM |
Peak forward voltage |
IFM=600A |
25 |
|
|
1.50 |
V |
Rth(j-c) |
Thermal resistance Junction to case |
At 180°sine. Single side cooled per chip |
|
|
|
0.20 |
℃/W |
Rth(c-h) |
Thermal resistance case to heatsink |
At 180°sine. Single side cooled per chip |
|
|
|
0.10 |
℃/W |
|
Fm
|
Terminal connection torque(M6) |
|
|
4.5 |
|
6.0 |
N·m |
Mounting torque(M6) |
|
|
4.5 |
|
6.0 |
N·m |
Tvj |
Junction temperature |
|
|
-40 |
|
150 |
℃ |
Tstg |
Stored temperature |
|
|
-40 |
|
125 |
℃ |
Wt |
Weight |
|
|
|
280 |
|
g |
Outline |
213F4 |
EN
