Brief introduction
Diode Modules(Non-isolated Type) ,MD300,800V~1800V,produced by TECHSEM .
VRRM |
Type & Outline |
800V |
MD300-08-407F2NA |
MD300-08-407F2NK |
1000V |
MD300-10-407F2NA |
MD300-10-407F2NK |
1300V |
MD300-12-407F2NA |
MD300-12-407F2NK |
1400V |
MD300-14-407F2NA |
MD300-14-407F2NK |
1600V |
MD300-16-407F2NA |
MD300-16-407F2NK |
1800V |
MD300-18-407F2NA |
MD300-18-407F2NK |
Features：
-
Non-isolated. Mounting base as common anode cathode terminal.
- Pressure contact technology withIncreased power cycling capability
- Low forward voltage drop
Typical Applications：
- Welding Power Supply
- Various Dc power supplies
|
SYMBOL
|
CHARACTERISTIC
|
TEST CONDITIONS
|
Tj(℃) |
VALUE |
UNIT
|
Min |
Type |
Max |
IF(AV) |
Mean forward current |
180°half sine wave 50Hz
Single side cooled, TC=100℃
|
150
|
|
|
300 |
A |
IF(RMS) |
RMS forward current |
|
|
471 |
A |
IRRM |
Repetitive peak current |
at VRRM |
150 |
|
|
10 |
mA |
IFSM |
Surge forward current |
VR=60%VRRM, t=10ms half sine |
150
|
|
|
10 |
kA |
I2t |
I2t for fusing coordination |
|
|
500 |
103A2s |
VFO |
Threshold voltage |
|
150
|
|
|
0.80 |
V |
rF |
Forward slope resistance |
|
|
0.64 |
mΩ |
VFM |
Peak forward voltage |
IFM=900A |
25 |
|
|
1.50 |
V |
Rth(j-c) |
Thermal resistance Junction to case |
Single side cooled per chip |
|
|
|
0.13 |
℃/W |
Rth(c-h) |
Thermal resistance case to heatsink |
Single side cooled per chip |
|
|
|
0.04 |
℃/W |
|
Fm
|
Terminal connection torque(M10) |
|
|
10 |
|
12 |
N·m |
Mounting torque(M6) |
|
|
4.5 |
|
6.0 |
N·m |
Tvj |
Junction temperature |
|
|
-40 |
|
150 |
℃ |
Tstg |
Stored temperature |
|
|
-40 |
|
125 |
℃ |
Wt |
Weight |
|
|
|
330 |
|
g |
Outline |
407F2NA, 407F2NK |
EN
