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Brief introduction
Diode Modules(Non-isolated Type) ,MD200,800V~1800V,210F2NA, 210F2NK ,produced by TECHSEM .
VRRM  | 
Type & Outline  | 
|
| 
 800V 1000V 1200V 1400V 1600V 1800V  | 
 MD200-08-210F2NA MD200-10-210F2NA MD200-12-210F2NA MD200-14-210F2NA MD200-16-210F2NA MD200-18-210F2NA  | 
 MD200-08-210F2NK MD200-10-210F2NK MD200-12-210F2NK MD200-14-210F2NK MD200-16-210F2NK MD200-18-210F2NK  | 
Features:
Typical Applications:
| 
 
 SYMBOL  | 
 
 CHARACTERISTIC  | 
 
 TEST CONDITIONS  | 
Tj(℃)  | 
VALUE  | 
 
 UNIT  | 
||
Min  | 
Type  | 
Max  | 
|||||
IF(AV)  | 
Mean forward current  | 
 180°half sine wave 50Hz Single side cooled, TC=100℃  | 
 
 150  | 
  | 
  | 
200  | 
A  | 
IF(RMS)  | 
RMS forward current  | 
  | 
  | 
314  | 
A  | 
||
IRRM  | 
Repetitive peak current  | 
at VRRM  | 
150  | 
  | 
  | 
8  | 
mA  | 
IFSM  | 
Surge forward current  | 
VR=60%VRRM, t=10ms half sine  | 
 
 150  | 
  | 
  | 
6.2  | 
kA  | 
I2t  | 
I2t for fusing coordination  | 
  | 
  | 
192  | 
103A2s  | 
||
VFO  | 
Threshold voltage  | 
  | 
 
 150  | 
  | 
  | 
0.80  | 
V  | 
rF  | 
Forward slope resistance  | 
  | 
  | 
0.96  | 
mΩ  | 
||
VFM  | 
Peak forward voltage  | 
IFM=600A  | 
25  | 
  | 
  | 
1.50  | 
V  | 
Rth(j-c)  | 
Thermal resistance Junction to case  | 
Single side cooled per chip  | 
  | 
  | 
  | 
0.20  | 
。C/W  | 
Rth(c-h)  | 
Thermal resistance case to heatsink  | 
Single side cooled per chip  | 
  | 
  | 
  | 
0.10  | 
。C/W  | 
| 
 
 Fm  | 
Terminal connection torque(M6)  | 
  | 
  | 
4.5  | 
  | 
6.0  | 
N·m  | 
Mounting torque(M6)  | 
  | 
  | 
4.5  | 
  | 
6.0  | 
N·m  | 
|
Tvj  | 
Junction temperature  | 
  | 
  | 
-40  | 
  | 
150  | 
℃  | 
Tstg  | 
Stored temperature  | 
  | 
  | 
-40  | 
  | 
125  | 
℃  | 
Wt  | 
Weight  | 
  | 
  | 
  | 
185  | 
  | 
g  | 
Outline  | 
210F2NA, 210F2NK  | 
||||||


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