Brief introduction
Fast Recovery Diode Modules , MZx250,Air Cooling,produced by TECHSEM .
VRRM |
Type & Outline |
|
600V
800V
1000V
1200V
1400V
1600V
1800V
1800V
|
MZx250-06-415F3
MZx250-08-415F3
MZx250-10-415F3
MZx250-12-415F3
MZx250-14-415F3
MZx250-16-415F3
MZx250-18-415F3
MZ250-18-415F3G
|
MZx stands for any type of MZC, MZA, MZK
Features：
- Isolated mounting base 3000V~
-
Pressure contact technology with Increased power cycling capability
- Space and weight saving
Typical Applications：
- Inverter
- Inductive heating
- Chopper
|
SYMBOL
|
CHARACTERISTIC
|
TEST CONDITIONS
|
Tj(℃) |
VALUE |
UNIT
|
Min |
Type |
Max |
IF(AV) |
Mean forward current |
180°half sine wave 50Hz
Single side cooled, TC=85℃
|
140
|
|
|
250 |
A |
IF (RMS) |
RMS forward current |
|
|
392 |
A |
IRRM |
Repetitive peak current |
at VRRM |
140 |
|
|
70 |
mA |
IFSM |
Surge forward current |
10ms half sine wave VR=0.6VRRM |
140
|
|
|
6.2 |
kA |
I2t |
I2t for fusing coordination |
|
|
192 |
103A2s |
VFO |
Threshold voltage |
|
140
|
|
|
1.08 |
V |
rF |
Forward slope resistance |
|
|
0.35 |
m |
VFM |
Peak forward voltage |
IFM=750A |
25 |
|
|
1.55 |
V |
trr |
Reverse recovery time |
IFM=300A, tp=4000μs, -di/dt=20A/μs,VR=50V |
140 |
|
4 |
|
μs |
25 |
|
3 |
|
μs |
Rth(j-c) |
Thermal resistance Junction to case |
Single side cooled per chip |
|
|
|
0.150 |
℃/W |
Rth(c-h) |
Thermal resistance case to heatsink |
Single side cooled per chip |
|
|
|
0.040 |
℃ /W |
Viso |
Isolation voltage |
50Hz,R.M.S,t= 1min,Iiso:1mA(MAX) |
|
3000 |
|
|
V |
|
Fm
|
Terminal connection torque(M10) |
|
|
10.0 |
|
12.0 |
N·m |
Mounting torque(M6) |
|
|
4.5 |
|
6.0 |
N·m |
Tvj |
Junction temperature |
|
|
-40 |
|
140 |
℃ |
Tstg |
Stored temperature |
|
|
-40 |
|
125 |
℃ |
Wt |
Weight |
|
|
|
1260 |
|
g |
Outline |
415F3 |
EN
