Brief introduction
Fast Recovery Diode Modules , MZ250,2800V~3000V,Air Cooling,produced by TECHSEM .
VRRM |
Type & Outline |
|
2000V
2200V
2500V
2800V
3000V
|
MZ250-20-417F2
MZ250-22-417F2
MZ250-25-417F2
MZ250-28-417F2
MZ250-30-417F2
|
Features：
-
Isolated mounting base 3000V~
-
Pressure contact technology with Increased power cycling capability
- Space and weight saving
Typical Applications：
- Inverter
- Inductive heating
- Chopper
|
SYMBOL
|
CHARACTERISTIC
|
TEST CONDITIONS
|
Tj(°C)
|
VALUE |
UNIT
|
Min |
Type |
Max |
IF(AV) |
Mean forward current |
180° half sine wave 50Hz
Single side cooled, TC=85°C
|
140
|
|
|
250 |
A |
IF(RMS) |
RMS forward current |
|
|
392 |
A |
IRRM |
Repetitive peak current |
at VRRM |
140 |
|
|
50 |
mA |
IFSM |
Surge forward current |
10ms half sine wave VR=0.6VRRM |
140
|
|
|
8 |
kA |
I2t |
I2t for fusing coordination |
|
|
320 |
103A2s |
VFO |
Threshold voltage |
|
140
|
|
|
1.85 |
V |
rF |
Forward slope resistance |
|
|
0.50 |
mΩ |
VFM |
Peak forward voltage |
IFM=750A |
25 |
|
|
2.67 |
V |
trr |
Reverse recovery time |
IFM=300A, tp=4000μs, -di/dt=20A/μs, VR= 100V |
140 |
|
4 |
|
μs |
Rth(j-c) |
Thermal resistance Junction to case |
Single side cooled per chip |
|
|
|
0.065 |
°C /W |
Rth(c-h) |
Thermal resistance case to heatsink |
Single side cooled per chip |
|
|
|
0.030 |
°C /W |
Viso |
Isolation voltage |
50Hz,R.M.S,t= 1min,Iiso:1mA(MAX) |
|
3000 |
|
|
V |
|
Fm
|
Terminal connection torque(M10) |
|
|
10 |
|
12 |
N·m |
Mounting torque(M6) |
|
|
4.5 |
|
6.0 |
N·m |
Tvj |
Junction temperature |
|
|
-40 |
|
140 |
°C |
Tstg |
Stored temperature |
|
|
-40 |
|
125 |
°C |
Wt |
Weight |
|
|
|
770 |
|
g |
Outline |
417F2 |
EN
