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Brief introduction
Fast Recovery Diode Modules , MZ250,2800V~3000V,Air Cooling,produced by TECHSEM .
VRRM | Type & Outline |
2000V 2200V 2500V 2800V 3000V |
MZ250-20-417F2 MZ250-22-417F2 MZ250-25-417F2 MZ250-28-417F2 MZ250-30-417F2 |
Features:
Typical Applications:
SYMBOL |
CHARACTERISTIC |
TEST CONDITIONS |
Tj(°C) | VALUE |
UNIT | ||
Min | Type | Max | |||||
IF(AV) | Mean forward current | 180° half sine wave 50Hz Single side cooled, TC=85°C |
140 |
|
| 250 | A |
IF(RMS) | RMS forward current |
|
| 392 | A | ||
IRRM | Repetitive peak current | at VRRM | 140 |
|
| 50 | mA |
IFSM | Surge forward current | 10ms half sine wave VR=0.6VRRM |
140 |
|
| 8 | kA |
I2t | I2t for fusing coordination |
|
| 320 | 103A2s | ||
VFO | Threshold voltage |
|
140 |
|
| 1.85 | V |
rF | Forward slope resistance |
|
| 0.50 | mΩ | ||
VFM | Peak forward voltage | IFM=750A | 25 |
|
| 2.67 | V |
trr | Reverse recovery time | IFM=300A, tp=4000μs, -di/dt=20A/μs, VR= 100V | 140 |
| 4 |
| μs |
Rth(j-c) | Thermal resistance Junction to case | Single side cooled per chip |
|
|
| 0.065 | °C /W |
Rth(c-h) | Thermal resistance case to heatsink | Single side cooled per chip |
|
|
| 0.030 | °C /W |
Viso | Isolation voltage | 50Hz,R.M.S,t= 1min,Iiso:1mA(MAX) |
| 3000 |
|
| V |
Fm | Terminal connection torque(M10) |
|
| 10 |
| 12 | N·m |
Mounting torque(M6) |
|
| 4.5 |
| 6.0 | N·m | |
Tvj | Junction temperature |
|
| -40 |
| 140 | °C |
Tstg | Stored temperature |
|
| -40 |
| 125 | °C |
Wt | Weight |
|
|
| 770 |
| g |
Outline | 417F2 |
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