Diode Modules,MDx160-08-229H3,MDx160-10-229H3,MDx160-12-229H3,MDx160-14-229H3,MDx160-16-229H3,MDx160-18-229H3
Features:
Typical Applications
VRSM | VRRM | Type & Outline |
900V | 800V | MDx160-08-229H3 |
1100V | 1000V | MDx160-10-229H3 |
1300V | 1200V | MDx160-12-229H3 |
1500V | 1400V | MDx160-14-229H3 |
1700V | 1600V | MDx160-16-229H3 |
1900V | 1800V | MDx160-18-229H3 |
SYMBOL |
CHARACTERISTIC |
TEST CONDITIONS |
Tj(°C) | VALUE |
UNIT | ||
Min | Type | Max | |||||
IF(AV) | Mean forward current | 180° half sine wave 50Hz Single side cooled, TC=100°C |
150 |
|
| 160 | A |
IF(RMS) | RMS forward current |
|
| 251 | A | ||
IRRM | Repetitive peak current | at VRRM | 150 |
|
| 12 | mA |
IFSM | Surge forward current |
10ms half sine wave VR=0.6VRRM |
150 |
|
| 4 | kA |
I2t | I2t for fusing coordination |
|
| 80 | A2s*103 | ||
VFO | Threshold voltage |
|
150 |
|
| 0.85 | V |
rF | Forward slope resistance |
|
| 1.25 | mΩ | ||
VFM | Peak forward voltage | IFM=480A | 25 |
|
| 1.50 | V |
Rth(j-c) | Thermal resistance Junction to case | Single side cooled per chip |
|
|
| 0.20 | C /W |
Rth(c-h) | Thermal resistance case to heatsink | Single side cooled per chip |
|
|
| 0.08 | C /W |
Viso | Isolation voltage | 50Hz,R.M.S,t=1min, Iiso:1mA(max) |
| 3000 |
|
| V |
Fm | Terminal connection torque(M6) |
|
| 4.5 |
| 6 | N·m |
Mounting torque(M6) |
|
| 4.5 |
| 6 | N·m | |
Tstg | Stored temperature |
|
| -40 |
| 125 | °C |
Wt | Weight |
|
|
| 165 |
| g |
Outline | 229H3 |
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